Component mounting apparatus

Metal working – Means to assemble or disassemble – Means to assemble electrical device

Reexamination Certificate

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Details

C029S739000, C029S833000

Reexamination Certificate

active

07827677

ABSTRACT:
A component mounting system includes first to third (pickup, transfer, and placement) stations. A component supplied at a component supply is picked up by a transport head at the pickup station and then transferred to a placement head at the transfer station. The placement head carries the component to the placement station where the component is placed and mounted onto a substrate such as a circuit board. The component, when held by the placement head, is recognized by an imaging device at or in the vicinity of the transfer station.

REFERENCES:
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patent: 5040291 (1991-08-01), Janisiewicz et al.
patent: 5203061 (1993-04-01), Hamada
patent: 5342460 (1994-08-01), Hidese
patent: 5491888 (1996-02-01), Sakurai et al.
patent: 5566447 (1996-10-01), Sakurai
patent: 5839187 (1998-11-01), Sato et al.
patent: 5855059 (1999-01-01), Togami et al.
patent: 5862586 (1999-01-01), Kimura
patent: 5894657 (1999-04-01), Kanayama et al.
patent: 6507996 (2003-01-01), Schweitzer
patent: 2-56944 (1990-02-01), None
patent: 7-153784 (1995-06-01), None
patent: 2001060795 (2001-03-01), None
patent: 97/38567 (1997-10-01), None
patent: 99 43192 (1999-08-01), None
Machine Translation of JP2001-060795A, obtained Jun. 2, 2010.

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