Component fabrication using thermal resist materials

Details Component fabrication using thermal resist materials Component fabrication using thermal resist materials

2011-08-02

2011-08-02

Duda, Kathleen (Department: 1722)

Radiation imagery chemistry: process, composition, or product th

Imaging affecting physical property of radiation sensitive...

Making electrical device

C430S329000, C430S311000

Reexamination Certificate

active

07989146

ABSTRACT:
A method for producing a patterned material for electronic or photonic circuits, comprising the steps of:p) providing a substrate;q) coating the substrate with a polymer layer;r) coating a thermal resist solution over the polymer layer to form a thermal resist layer, wherein the polymer layer is substantially immiscible in the thermal resist solution;s) exposing predetermined areas of the thermal resist layer, corresponding to a desired image pattern, using infrared light;t) removing portions of the thermal resist layer corresponding to a desired image pattern, using a developer;u) removing the polymer layer where the thermal resist layer has been previously removed and undercutting a portion of the remaining thermal resist layer by an etching process;v) depositing a material using a substantially anisotropic process; and removing the remaining thermal resist layer and any overlying material with a solvent for the polymer or thermal resist layers leaving the material in a desired pattern.

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