Component and method for producing a component

Details Component and method for producing a component Component and method for producing a component

2011-03-22

2011-03-22

Tran, Minh-Loan T (Department: 2826)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Configuration or pattern of bonds

C257S737000, C257S738000, C257S778000, C257S734000, C257S784000, C257S276000, C257S457000, C257S459000, C257S584000, C257S690000, C257S081000, C257S091000, C257S099000, C257SE23069, C257SE23070, C257SE23051, C257SE23101, C257SE21503, C257SE33075, C257SE31131

Reexamination Certificate

active

07911068

ABSTRACT:
A component and a method for producing a component are disclosed. The component comprises an integrated circuit, a housing body, a wiring device overlapping the integrated circuit and the housing body, and one or more external contact devices in communication with the wiring device.

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German Office Action dated Feb. 8, 2007(and English Translation).
German Office Action for related German patent application, mailed Nov. 3, 2009. English translation included.

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