Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate
2005-02-08
2005-02-08
Williams, Alexander Oscar (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Flip chip
C257S779000, C257S784000, C257S786000, C257S777000, C257S738000, C257S737000, C257S700000, C257S701000, C257S758000
Reexamination Certificate
active
06853087
ABSTRACT:
Permanent physical and electrical attachment of electrically conductive contacts of a first component in a RFID device, such as a smart card or smart inlay, is made to the electrically conductive contacts of a second component of the device, for example, a conductive area, such as an antenna. Attachment is achieved by co-depositing metal and electrically conductive hard particles upon the conductive contacts of either the first or second components and then using a non-conductive adhesive to provide permanent bond between the components and their conductive contacts.
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Blum Frederick A.
Kober Michael
Neuhaus Herbert J.
Wernle Michael E.
Nanopierce Technologies, Inc.
Williams Alexander Oscar
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