Compliant wafer chuck

Details Compliant wafer chuck Compliant wafer chuck

2006-09-19

2006-09-19

Thomas, David B. (Department: 3723)

Abrading

Machine

Rotary tool

C451S289000, C451S364000, C451S397000

Reexamination Certificate

active

07108591

ABSTRACT:
A semiconductor substrate support is provided. The semiconductor substrate support includes a chuck configured to change between a compliant state and a rigid state. An electromagnetic field source configured to apply an electromagnetic field to the chuck is included. The electromagnetic field causes the chuck to change from the compliant state to the rigid state. A method for supporting a semiconductor substrate and a system for cleaning a substrate and an apparatus are also provided.

REFERENCES:
patent: 5607341 (1997-03-01), Leach
patent: 5827111 (1998-10-01), Ball
patent: 5882243 (1999-03-01), Das et al.
patent: 5964646 (1999-10-01), Kassir et al.
patent: 6030275 (2000-02-01), Lofaro
patent: 6059638 (2000-05-01), Crevasse et al.
patent: 6390901 (2002-05-01), Hiyama et al.
patent: 6413155 (2002-07-01), Matsuo et al.
patent: 6436828 (2002-08-01), Chen et al.
patent: 6520845 (2003-02-01), Hirokawa et al.
patent: 6592434 (2003-07-01), Vanell et al.
patent: 6855032 (2005-02-01), Yang et al.
patent: 6863771 (2005-03-01), Brown
patent: 6899607 (2005-05-01), Brown
patent: 2002/0098785 (2002-07-01), Doan et al.
patent: 2004/0038625 (2004-02-01), Chandrasekaran
patent: 2004/0137829 (2004-07-01), Park et al.
patent: 2004/0142635 (2004-07-01), Elledge

Affiliated with

Also associated with

Rating

Compliant wafer chuck does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Compliant wafer chuck, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Compliant wafer chuck will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3613394