Compliant pad wafer chuck

Details Compliant pad wafer chuck Compliant pad wafer chuck

2005-05-13

2009-06-02

Hollington, Jermele M (Department: 2829)

Electricity: measuring and testing

Fault detecting in electric circuits and of electric components

Of individual circuit component or element

Reexamination Certificate

active

07541826

ABSTRACT:
A platform is designed to support thin flat substrates, such as semiconductor wafers, during observation of characteristics of the substrates. The platform includes a rigid base having a top surface. A resilient pad is supported on the base and the pad has a top surface, at least a portion of which yieldingly supports a flat substrate placed thereon.

REFERENCES:
patent: 4642889 (1987-02-01), Grabbe
patent: 5900738 (1999-05-01), Khandros et al.
patent: 6287174 (2001-09-01), Detzel et al.
patent: 6315649 (2001-11-01), Hu et al.
patent: 6407006 (2002-06-01), Levert et al.
patent: 6464574 (2002-10-01), Halley
patent: 6547651 (2003-04-01), Boyd et al.
patent: 6835415 (2004-12-01), Blaedel et al.
patent: 6984168 (2006-01-01), Melvin et al.
patent: 7029381 (2006-04-01), Melvin et al.
patent: 2001/0036749 (2001-11-01), Levert et al.
patent: 2002/0127862 (2002-09-01), Cooper et al.
patent: 2002/0137448 (2002-09-01), Suh et al.
patent: 2004/0131775 (2004-07-01), Blaedel et al.

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