Compliant grinding wheel

Details Compliant grinding wheel Compliant grinding wheel

2007-08-07

2007-08-07

MacArthur, Sylvia R. (Department: 1763)

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

For liquid etchant

C451S057000, C451S495000, C451S059000

Reexamination Certificate

active

10816504

ABSTRACT:
A pre-planarization module configured to perform a long range planarization operation is provided. The pre-planarization module includes a semiconductor substrate support configured to rotate about a first axis. The pre-planarization module also includes an annular ring having a first side with a compliant layer affixed thereto. The second side of the compliant layer is affixed to a planarizing surface. The annular ring is configured to move perpendicular and parallel to a plane associated with the substrate support. Additionally, the annular ring is configured to rotate about a second axis, where the second axis is offset from the first axis. The substrate support and the annular ring rotate in the same direction. A method for performing a planarization process and a substrate grinding device are also provided.

REFERENCES:
patent: 6083083 (2000-07-01), Nishimura
patent: 6290584 (2001-09-01), Kim et al.
patent: 6302770 (2001-10-01), Aiyer
patent: 6565705 (2003-05-01), Hung et al.
patent: 6572462 (2003-06-01), Vanell
patent: 7033251 (2006-04-01), Elledge
patent: 7108591 (2006-09-01), Boyd et al.
patent: 2002/0173244 (2002-11-01), Sekiya et al.
patent: 2004/0214514 (2004-10-01), Elledge
Merriam-Webster's Online Dictionary. Definition of “ring”.

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