Compliant and hermetic solder seal

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type

Reexamination Certificate

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Details

C174S050510, C174S050510, C257S710000, C257S729000, C257S730000

Reexamination Certificate

active

06958446

ABSTRACT:
A solder joint or seal attaching components having dissimilar coefficients of thermal expansion is made thin (e.g., less than 20 μm and preferably about 5 μm) and of a solder such as an indium-based solder that has a tendency to creep. The solder is toroidal or otherwise shaped to avoid tensile stress in the solder. Axial shearing stress in the solder causes reversible creep without causing failure of the joint or seal. In one embodiment, a toroidal solder seal has a diameter, a footprint, and a thickness in approximate proportions of 5000:200:1.

REFERENCES:
patent: 3823468 (1974-07-01), Hascoe
patent: 4709122 (1987-11-01), Samuels
patent: 5050034 (1991-09-01), Hegner et al.
patent: 5064782 (1991-11-01), Nishiguchi
patent: 5168344 (1992-12-01), Ehlert et al.
patent: 5248853 (1993-09-01), Ishikawa et al.
patent: 5256370 (1993-10-01), Slattery et al.
patent: 5329160 (1994-07-01), Miura et al.
patent: 5821161 (1998-10-01), Covell et al.
patent: 6195478 (2001-02-01), Fouquet
patent: 6259608 (2001-07-01), Berardinelli et al.
patent: 6324316 (2001-11-01), Fouquet et al.
patent: 6459160 (2002-10-01), Goldmann et al.
patent: 6627814 (2003-09-01), Stark
patent: 6713862 (2004-03-01), Palanisamy et al.
patent: 6848610 (2005-02-01), Liu
patent: 2036794 (1980-07-01), None
patent: 2379630 (2003-03-01), None
patent: 7254840 (1995-10-01), None
Humpston, Giles and Jacobson, David M., “Principles of Soldering and Brazing”, ASM International, Materials Park, Ohio, pp. 123-127 (Mar. 1993).
Koehler, Dale R. et al., “ Ultraminiature Resonator Accelerometer” Sandia Report SAND96-0971, UC-700 (Apr. 1996).

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