Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate
2005-10-25
2005-10-25
Lam, Cathy F. (Department: 1775)
Electricity: conductors and insulators
Boxes and housings
Hermetic sealed envelope type
C174S050510, C174S050510, C257S710000, C257S729000, C257S730000
Reexamination Certificate
active
06958446
ABSTRACT:
A solder joint or seal attaching components having dissimilar coefficients of thermal expansion is made thin (e.g., less than 20 μm and preferably about 5 μm) and of a solder such as an indium-based solder that has a tendency to creep. The solder is toroidal or otherwise shaped to avoid tensile stress in the solder. Axial shearing stress in the solder causes reversible creep without causing failure of the joint or seal. In one embodiment, a toroidal solder seal has a diameter, a footprint, and a thickness in approximate proportions of 5000:200:1.
REFERENCES:
patent: 3823468 (1974-07-01), Hascoe
patent: 4709122 (1987-11-01), Samuels
patent: 5050034 (1991-09-01), Hegner et al.
patent: 5064782 (1991-11-01), Nishiguchi
patent: 5168344 (1992-12-01), Ehlert et al.
patent: 5248853 (1993-09-01), Ishikawa et al.
patent: 5256370 (1993-10-01), Slattery et al.
patent: 5329160 (1994-07-01), Miura et al.
patent: 5821161 (1998-10-01), Covell et al.
patent: 6195478 (2001-02-01), Fouquet
patent: 6259608 (2001-07-01), Berardinelli et al.
patent: 6324316 (2001-11-01), Fouquet et al.
patent: 6459160 (2002-10-01), Goldmann et al.
patent: 6627814 (2003-09-01), Stark
patent: 6713862 (2004-03-01), Palanisamy et al.
patent: 6848610 (2005-02-01), Liu
patent: 2036794 (1980-07-01), None
patent: 2379630 (2003-03-01), None
patent: 7254840 (1995-10-01), None
Humpston, Giles and Jacobson, David M., “Principles of Soldering and Brazing”, ASM International, Materials Park, Ohio, pp. 123-127 (Mar. 1993).
Koehler, Dale R. et al., “ Ultraminiature Resonator Accelerometer” Sandia Report SAND96-0971, UC-700 (Apr. 1996).
Humpston Giles
Ichimura Yoshikatsu
Mar Nancy M.
Miller Daniel J.
Nystrom Michael J.
Agilent Technologie,s Inc.
Lam Cathy F.
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