Complete chip I/O test through low contact testing using enhance

Details Complete chip I/O test through low contact testing using enhance Complete chip I/O test through low contact testing using enhance

1996-07-29

1998-07-28

Beausoliel, Jr., Robert W.

Excavating

371 2231, 371 2232, 324765, G01R 3128

Patent

active

057870985

ABSTRACT:
A system and method for evaluating solder ball connections to a flip-chip or the like integrated circuit device through an extension of boundary scan testing circuits and techniques. The existence, size, and connective efficacy of solder balls deposited on pads are indirectly verified through the inclusion of a boundary scan driver and receiver with each pad. The respective drivers and receivers are connected to the complementing sections of a segmented pad metallurgy. The formation of a correct size solder ball connects the driver and receiver to allow boundary scan verification of all the electrical connections in the path. Thereby, low contact testing can be used to verify the integrity of the integrated circuit as well as any solder ball type die (chip) output contacts.

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