Complaint bonding structures for semiconductor devices

Details Complaint bonding structures for semiconductor devices Complaint bonding structures for semiconductor devices

2011-01-25

2011-01-25

Dang, Trung (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Flip chip

C257S780000, C257S782000, C257SE23003

Reexamination Certificate

active

07875984

ABSTRACT:
A compliant bonding structure is disposed between a semiconductor light emitting device and a mount. When the semiconductor light emitting device is attached to the mount, for example by providing pressure, heat, and/or ultrasonic energy to the semiconductor light emitting device, the compliant bonding structure collapses to partially fill a space between the semiconductor light emitting device and the mount. In some embodiments, the compliant bonding structure is plurality of metal bumps that undergo plastic deformation during bonding. In some embodiments, the compliant bonding structure is a porous metal layer.

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By Joachim Kloeser et al.; Entitled: “High-Performance Flicp Chip Packages With Copper Pillar Bumping” www.globalsmt.net; Global SMT & Packaging; May 2006; pp. 28-31.

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