Electronic digital logic circuitry – Interface – Current driving
Patent
1997-04-10
1999-03-23
Tokar, Michael
Electronic digital logic circuitry
Interface
Current driving
326 86, 326 90, 341100, 341101, 257 48, H03K 190175, H01L 2358, H03M 900
Patent
active
058865390
ABSTRACT:
A circuit for communicating between structures of an integrated circuit through a metallized layer is provided in which parallel data bits are bundled into serial data packages, serialized and sent from a structure to the metallized layer. A destination structure receives the serial data package from the metallized layer and deserializes the package back into a parallel set of data bits. The metallized layer may extend over a significant portion of a substrate of a chip as a metallized data plane or metallized clock plane. Moreover, the metallized layer may be coupled to a pin to allow communications between structures of separate integrated circuits.
REFERENCES:
patent: 5132572 (1992-07-01), Woo
patent: 5220216 (1993-06-01), Woo
patent: 5227679 (1993-07-01), Woo
patent: 5264745 (1993-11-01), Woo
patent: 5349612 (1994-09-01), Guo et al.
patent: 5363419 (1994-11-01), Ho
patent: 5367542 (1994-11-01), Guo
patent: 5400370 (1995-03-01), Guo
patent: 5452333 (1995-09-01), Guo et al.
patent: 5457336 (1995-10-01), Fang et al.
patent: 5457719 (1995-10-01), Guo et al.
patent: 5576554 (1996-11-01), Hsu
Advanced Micro Devices, Ind
Chang Daniel D.
Tokar Michael
LandOfFree
Communication within an integrated circuit by data serialization does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Communication within an integrated circuit by data serialization, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Communication within an integrated circuit by data serialization will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2130029