Etching a substrate: processes – Masking of a substrate using material resistant to an etchant
Reexamination Certificate
2007-11-06
2007-11-06
Deo, Duy-Vu N. (Department: 1765)
Etching a substrate: processes
Masking of a substrate using material resistant to an etchant
C216S083000, C216S095000, C216S096000, C216S090000, C216S092000, C216S100000, C216S102000, C438S978000, C438S745000, C438S747000, C438S749000, C438S750000
Reexamination Certificate
active
10704562
ABSTRACT:
A combined wet etching method for stacked films which is capable of performing etching processes in a collective manner while controlling an amount of side-etching on each of stacked films and of making uniform side edges. In the wet etching method, two or more types of etching methods are performed in combination, on stacked films containing first and second films being deposited sequentially on a substrate and each having a different film property. The two or more types of wet etching methods include, at least, a first wet etching method in which side-etching on the first film is facilitated more than side-etching on the second film and a second wet etching method in which side-etching on the second film is facilitated more than side-etching on the first film.
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Kimura Shigeru
Uesugi Tadanori
Deo Duy-Vu N.
George Patricia A.
NEC LCD Technologies Ltd.
Young & Thompson
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