Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1994-04-05
1996-05-28
Hille, Rolf
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257719, 361710, 361719, H01L 2334
Patent
active
055214398
ABSTRACT:
A combination of an electronic semiconductor device comprising a metal plate and a plastics body which encapsulates the metal plate leaving at least a major surface thereof exposed, a heat sink, and means of fastening the heat sink to the device. To enable securement of the heat sink on the device without any external fastening arrangement having to be used, and without unduly straining the solder spot of the device pins to a printed circuit, the device is provided with undercut regions on opposite sides adjacent to the exposed surface of the plate for releasable engagement by the fastening means.
REFERENCES:
patent: 4169642 (1979-10-01), Mouissie
patent: 4745456 (1988-05-01), Clemens
patent: 4878108 (1989-10-01), Phelps, Jr. et al.
patent: 4933746 (1990-06-01), King
patent: 4978638 (1990-12-01), Buller et al.
patent: 5276585 (1994-01-01), Smithers
Low Profile Heat Sink, IBM Technical Disclosure Bulletin, vol. 28 No. 12 May 1986 pp. 5172-5173.
"Cooling Enhancement of Intel 386/486 By Clip-On Heat Sink," IBM Technical Disclosure Bulletin, 33(2):218-219, 1990.
Casati Paolo
Marchisi Giuseppe
Carlson David V.
Hille Rolf
Iannucci Robert
Ostrowski David
SGS-Microelectronics S.r.l.
LandOfFree
Combination and method for coupling a heat sink to a semiconduct does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Combination and method for coupling a heat sink to a semiconduct, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Combination and method for coupling a heat sink to a semiconduct will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-789080