Cold/dry substrate treatment technique which improves photolitho

Radiation imagery chemistry: process – composition – or product th – Imaging affecting physical property of radiation sensitive... – Making electrical device

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430271, 430272, 430315, 430935, 430312, 174 685, G03C 500

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active

044904576

ABSTRACT:
A limitation in the use of ceramic substrates for electronic packaging is that photolithographic processes applied to such substrate surfaces do not give the highest resolution that the process is capable of because of inherent surface topographical variations on the ceramic substrate. A smoothing layer of a dry film glazed photosensitive material, such as RISTON solder mask, is laminated over the substrate surface, exposed with UV and cured. Metal conductor lines are then bonded onto the surface of the solder mask layer.

REFERENCES:
patent: 3606679 (1971-09-01), Schroeder
patent: 3873313 (1975-03-01), Horst et al.
patent: 4064287 (1977-12-01), Lipson et al.
patent: 4167413 (1979-09-01), Christ et al.

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