Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1995-03-27
1996-11-26
Dang, Thi
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
216 68, 20419212, 20419232, 427569, H05H 100
Patent
active
055781659
ABSTRACT:
The present invention relates to a method for generating a low pressure plasma circulating in a planar direction within a process enclosure. The invention generates plasma having substantially uniform density characteristics across a planar axis. The invention achieves improved uniformity of the plasma density by delivering more radio frequency power toward the periphery of the circulating plasma than toward the center of the plasma. Increasing the periphery power to the circulating plasma compensates for increased plasma losses due to interaction with the side walls of the process containment enclosure.
REFERENCES:
patent: 5401350 (1995-03-01), Patrick et al.
Bose Frank
Patrick Roger
Schoenborn Philippe
Toda Harry
Dang Thi
LSI Logic Corporation
LandOfFree
Coil configurations for improved uniformity in inductively coupl does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Coil configurations for improved uniformity in inductively coupl, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Coil configurations for improved uniformity in inductively coupl will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1970312