Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate
2007-12-25
2007-12-25
Lebentritt, Michael (Department: 2812)
Semiconductor device manufacturing: process
Coating of substrate containing semiconductor region or of...
Insulative material deposited upon semiconductive substrate
C438S685000, C438S761000, C438S778000, C438S780000, C438S783000, C438S790000, C257SE21274
Reexamination Certificate
active
11124451
ABSTRACT:
Methods of film deposition using metals and metal oxides. A thin film of germanium oxide and an oxide of a non-germanium metal is deposited by ALD by alternating deposition of first and second precursor compounds, wherein the first precursor compound includes a metal other than germanium, and the second precursor compound includes germanium.
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“Microwave Discharge Deposition of Oxide Films at Low Temperatures”, D.R. Secrist and J.D. Mackenzie, 1966, American Ceramic Society, pp. 784-788.
Inman Ronald S.
Jursich Gregory M.
Clark Brandon S.
Lebentritt Michael
Lee Kyoung
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