Coating apparatus and method

Coating processes – Centrifugal force utilized

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Details

427384, 4273855, 118 52, 118 59, B05D 312

Patent

active

055806074

ABSTRACT:
A coating apparatus comprises a chuck on which a semiconductor wafer is adhered, a resist liquid supplying system for supplying a resist liquid to the semiconductor wafer, a motor for rotating the semiconductor wafer, thereby spreading the resist liquid over the semiconductor wafer, and a plate, on which the semiconductor wafer is placed, for creating a temperature distribution on the semiconductor wafer.

REFERENCES:
patent: 4851263 (1989-07-01), Ishii et al.

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