Co-sintered surface metallization for pin-join, wire-bond and ch

Details Co-sintered surface metallization for pin-join, wire-bond and ch Co-sintered surface metallization for pin-join, wire-bond and ch

1994-12-21

1997-03-18

Jordan, Charles T.

Powder metallurgy processes

Powder metallurgy processes with heating or sintering

Making composite or hollow article

419 8, 419 9, B22F 702, B22F 704

Patent

active

056131810

ABSTRACT:
A co-sintered ceramic substrate structure is formed through punching and screening of a plurality of ceramic green sheets with a plurality of composite metal pastes and/or inks and laminating the structure. The co-sintered surface metallization comprises dual screened composite metal pastes, one on top of the other and bonded to the sintered ceramic substrate to provide bonding of the surface metallization to the sintered ceramic substrate.

REFERENCES:
patent: H1448 (1995-06-01), Goode, Jr.
patent: 3770874 (1973-11-01), Krieger et al.
patent: 4025997 (1977-05-01), Gernitis et al.
patent: 4057777 (1977-11-01), Merz et al.
patent: 4234367 (1980-11-01), Herron et al.
patent: 4413061 (1983-11-01), Kumar et al.
patent: 4808770 (1989-02-01), Prabhu et al.
patent: 4816615 (1989-03-01), Prabhu et al.
patent: 5004653 (1991-04-01), Kroisenbrunner
patent: 5035957 (1991-07-01), Bartlett et al.
patent: 5073180 (1991-12-01), Farooq et al.
patent: 5167913 (1992-12-01), Acocella et al.
patent: 5216207 (1993-06-01), Prabhu et al.
patent: 5236787 (1993-08-01), Grassi
patent: 5358793 (1994-10-01), Hanada et al.
patent: 5405707 (1995-04-01), Tani et al.
patent: 5422190 (1995-06-01), Alexander
patent: 5495978 (1996-03-01), Muth
Haddad, "Metallizing Multilayer Ceramic Top and Bottom Side", IBM Technical Disclosure Bulletin, V16 N11, dtd Apr. 1974, p. 3612.

Affiliated with

Also associated with

Rating

Co-sintered surface metallization for pin-join, wire-bond and ch does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Co-sintered surface metallization for pin-join, wire-bond and ch, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Co-sintered surface metallization for pin-join, wire-bond and ch will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1714135