Co-sintered surface metallization for pin-join, wire-bond and ch

Details Co-sintered surface metallization for pin-join, wire-bond and ch Co-sintered surface metallization for pin-join, wire-bond and ch

1995-11-07

1997-08-05

Jordan, Charles T.

Stock material or miscellaneous articles

All metal or with adjacent metals

Having metal particles

428544, 428545, B22F 702

Patent

active

056552130

ABSTRACT:
A co-sintered ceramic substrate structure is formed through punching and screening of a plurality of ceramic green sheets with a plurality of composite metal pastes and/or inks and laminating the structure. The co-sintered surface metallization comprises dual screened composite metal pastes, one on top of the other and bonded to the sintered ceramic substrate to provide bonding of the surface metallization to the sintered ceramic substrate.

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