CMP slurry and method of manufacturing semiconductor device

Details CMP slurry and method of manufacturing semiconductor device CMP slurry and method of manufacturing semiconductor device

2007-04-03

2007-04-03

Norton, Nadine G. (Department: 1765)

Compositions

Etching or brightening compositions

C252S079200, C252S079400, C438S692000

Reexamination Certificate

active

10902940

ABSTRACT:
CMP slurry contains a polishing component to polish a region to be polished, which includes at least one of a sub-region made of insulative material and a sub-region made of conductive material, and a restoring component to restore a scratch caused on the region to be polished. The scratch can be thus reduced during the polishing.

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patent: 2001/0049912 (2001-12-01), Motonari et al.
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patent: 2002-511650 (2002-04-01), None
Tsutsumi et al., Polsihing Water-Repellent Compostion for Automobile, Apr. 11, 2000, ComputerGenerated English Translation of JP 2000104047 A, 10 pages.
Notification of Reasons for Rejection issued by Japanese Patent Office on Oct. 5, 2004 in Japanese application No. 2001-362923, and English translation of Notification.

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