Abrading – Abrading process – Glass or stone abrading
Reexamination Certificate
2005-05-24
2005-05-24
Wilson, Lee D. (Department: 3723)
Abrading
Abrading process
Glass or stone abrading
C451S028000, C451S036000
Reexamination Certificate
active
06896590
ABSTRACT:
Disclosed is a CMP slurry, comprising a dispersion containing first particles having a primary particle diameter falling within a range of 5 nm to 50 nm and second particles having a primary particle diameter falling within a range of 50 nm to 100 nm, the concentration of the first particles in the dispersion falling within a range of 0.5 to 5% by weight, and the concentration of the second particles in the dispersion falling within a range of 0.01 to 0.1% by weight.
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Yano et al., U.S. Appl. No. 09/531,163, “Aqueous Dispersion, Aqueous Dispersion for Chemical Mechanical Polishing Used For Manufacture Of Semiconductor Devices, Method For Manufacture of Semiconductor Devices, And Method For Formation Of Embedded Wiring”, filed Mar. 17, 2000.
Minamihaba et al., U.S. Appl. No. 09/527,600, “Slurry For CMP and CMP Method”, filed Mar. 17, 2000.
Minamihaba Gaku
Yano Hiroyuki
Kabushiki Kaisha Toshiba
Wilson Lee D.
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