Abrading – Abrading process – Utilizing fluent abradant
Patent
1997-10-30
1999-06-29
Eley, Timothy V.
Abrading
Abrading process
Utilizing fluent abradant
451 56, 451 72, 451287, 451443, 451456, B24B 100
Patent
active
059160101
ABSTRACT:
In a chemical-mechanical-polishing (CMP) process, semiconductor substrates are rotated against a polishing pad covered by a layer of polishing slurry. A polishing pad maintenance apparatus is developed to reduce glazing effects, enhance the pad's operating life, achieve uniform planarity through a constant polishing rate, and minimize scratches or other defects from the polished surface, during a chemical-mechanical polishing process. This invention combines both the removal of particles and debris while effectively conditioning the pad surface. The polishing pad maintenance apparatus performs three main functions: loosening particles and debris; conditioning the polishing pad; and, removing the remaining particles and debris that result from the slurry and conditioning processes. The three functions are performed in sequence by a forced fluid spray, an abrasive mechanical agitator, and a vacuum. A conditioning housing assembly supports the three components that perform the maintenance functions: a) a forced fluid spray assembly; b) a mechanically abrasive plate; and, c) a vacuum attachment assembly.
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Varian James T.
Varian Kathryn H.
Eley Timothy V.
International Business Machines - Corporation
Peterson Peter W.
Shanley Daniel G.
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