Abrading – Precision device or process - or with condition responsive... – With indicating
Patent
1998-06-15
2000-08-08
Eley, Timothy V.
Abrading
Precision device or process - or with condition responsive...
With indicating
451 41, 451268, 451269, 451317, 451324, 451385, 451398, B24B 500, B24B 4900
Patent
active
060993871
ABSTRACT:
Apparatus and method for polishing one or both sides of a semiconductor wafer that has a central opening are provided. In one aspect, the apparatus includes a mandrel for holding the wafer and a motor coupled to the mandrel that is operable to rotate the mandrel. A first polisher assembly is provide that has a first polish pad for polishing the first side of the wafer and a second polish pad for polishing the second side of the wafer, and first means for moving the first and second polish pads into and out of engagement with the first and second sides of the wafer. According to the method, a semiconductor wafer is coupled to a rotatable mandrel and a polishing mixture is dispensed on one or both of the sides of the semiconductor wafer. A first polish pad is brought into contact with the first side of the semiconductor wafer and a second polish pad is brought into contact with the second side of the semiconductor wafer such that the first and second polish pads are positioned in opposition. The mandrel is rotated to spin the wafer.
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Gardner Mark I.
Gilmer Mark C.
Advanced Micro Devices , Inc.
Eley Timothy V.
Honeycutt Timothy M.
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