Abrasive tool making process – material – or composition – With inorganic material
Reexamination Certificate
2011-08-23
2011-08-23
Green, Anthony J (Department: 1731)
Abrasive tool making process, material, or composition
With inorganic material
C051S308000, C051S309000, C451S028000, C451S041000, C451S060000
Reexamination Certificate
active
08002860
ABSTRACT:
The present invention discloses a CMP abrasive comprising cerium oxide particles, a dispersant, an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl group present on a surface of a film to be polished and water, a method for polishing a substrate comprising polishing a film to be polished by moving a substrate on which the film to be polished is formed and a polishing platen while pressing the substrate against the polishing platen and a polishing cloth and supplying the CMP abrasive between the film to be polished and the polishing cloth, a method for manufacturing a semiconductor device comprising the steps of the above-mentioned polishing method, and an additive for a CMP abrasive comprising an organic polymer having an atom or a structure capable of forming a hydrogen bond with a hydroxyl group present on a surface of a film to be polished, and water.
REFERENCES:
patent: 3574823 (1971-04-01), Roberts et al.
patent: 4222747 (1980-09-01), Dauguet et al.
patent: 5603654 (1997-02-01), Hayashi
patent: 5733819 (1998-03-01), Kodama et al.
patent: 5759917 (1998-06-01), Grover et al.
patent: 5997620 (1999-12-01), Kodama et al.
patent: 6224464 (2001-05-01), Nojo et al.
patent: 6248143 (2001-06-01), Masuda et al.
patent: 6299795 (2001-10-01), Liu et al.
patent: 6416685 (2002-07-01), Zhang et al.
patent: 6420269 (2002-07-01), Matsuzawa et al.
patent: 2001/0024933 (2001-09-01), Sachan et al.
patent: 2003/0181046 (2003-09-01), Sachan et al.
patent: 0 373 501 (1990-06-01), None
patent: 0 820 092 (1998-01-01), None
patent: 0 846 740 (1998-06-01), None
patent: 62-043482 (1987-02-01), None
patent: 0603342 (1994-02-01), None
patent: 09-270402 (1997-10-01), None
patent: 410102040 (1998-04-01), None
patent: 2000109802 (2000-04-01), None
patent: WO 99/64527 (1999-12-01), None
Supplementary European Search Report, for Application No. EP 00 93 7240, dated Oct. 24, 2002.
Ashizawa Toranosuke
Haga Kouji
Hirai Keizou
Koyama Naoyuki
Machii Youiti
Antonelli, Terry Stout & Kraus, LLP.
Green Anthony J
Hitachi Chemical Co. Ltd.
Parvini Pegah
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