CMOS transistors with differential oxygen content high-K...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

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C257S407000, C257SE29132, C257SE29154, C257SE29158

Reexamination Certificate

active

08035173

ABSTRACT:
An NFET containing a first high-k dielectric portion and a PFET containing a second high-k gate dielectric portion are formed on a semiconductor substrate. A gate sidewall nitride is formed on the gate of the NFET, while the sidewalls of the PFET remain free of the gate sidewall nitride. An oxide spacer is formed directly on the sidewalls of a PFET gate stack and on the gate sidewall nitride on the NFET. After high temperature processing, the first and second dielectric portions contain a non-stoichiometric oxygen deficient high-k dielectric material. The semiconductor structure is subjected to an anneal in an oxygen environment, during which oxygen diffuses through the oxide spacer into the second high-k dielectric portion. The PFET comprises a more stoichiometric high-k dielectric material and the NFET comprises a less stoichiometric high-k dielectric material. Threshold voltages of the PFET and the NFET are optimized by the present invention.

REFERENCES:
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Akiyama, K., et al., “VFB Roll-off in HfO2 Gate Stack after High Temperature Annealing Process—A Crucial Role of Out-diffused Oxygen from HfO2 to Si”, 2007 Symposium on VLSI Technology Digest of Technical Papers, pp. 72-73.
Cartier, E., et al., “Role of Oxygen Vacancies in VFB/Vt stability of pFET metals on HfO2”, 2005 Symposium on VLSI Technology Digest of Technical Papers, pp. 230-231.
Shiraishi, K., et al., “Physics in Fermi Level Pinning at the PolySi/Hf-based High-k Oxide Interface” 2004 Symposium on VLSI Technology Digest of Technical Papers, pp. 108-109.

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