CMOS-MEMS process

Semiconductor device manufacturing: process – Making device or circuit responsive to nonelectrical signal – Physical stress responsive

Reexamination Certificate

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Details

C438S052000, C257SE21613, C257SE29324

Reexamination Certificate

active

07435612

ABSTRACT:
A fully CMOS compatible MEMS multi-project wafer process comprises coating a layer of thick photoresist on a wafer surface, patterning the photoresist to define a micromachining region, and performing a micromachining in the micromachining region to form suspended microstructures.

REFERENCES:
patent: 7012322 (2006-03-01), Ridley et al.
patent: 7026247 (2006-04-01), Dokumaci et al.

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