CMOS image sensor and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C257S291000, C257S432000, C257SE31120, C257SE21252, C257SE27132, C438S070000

Reexamination Certificate

active

07423307

ABSTRACT:
Provided are a CMOS image sensor in which microlenses are formed in a remaining space in a patterned light shielding layer to improve image sensor characteristics and to protect the microlenses during packaging, and a method of fabricating the same. The CMOS image sensor may include: a semiconductor substrate; at least one photodiode on or in the semiconductor substrate; a first insulating layer on the substrate including the photodiode(s); a plurality of metal lines on and/or in the first insulating layer; a second insulating layer on the first insulating layer including at least some of the metal lines; a patterned light shielding layer on the second insulating layer; and microlenses in a remaining space on the second insulating layer.

REFERENCES:
patent: 4722910 (1988-02-01), Yasaitis
patent: 5162887 (1992-11-01), Dierschke
patent: 5494857 (1996-02-01), Cooperman et al.
patent: 6055460 (2000-04-01), Shopbell
patent: 6128091 (2000-10-01), Uchida et al.
patent: 6187684 (2001-02-01), Farber
patent: 6379992 (2002-04-01), Jo
patent: 6414343 (2002-07-01), Kondo et al.
patent: 6746933 (2004-06-01), Beintner et al.
patent: 6875558 (2005-04-01), Gaillard et al.
patent: 7279353 (2007-10-01), Rhodes
patent: 2006/0056034 (2006-03-01), Tsuruma
patent: 2006/0073623 (2006-04-01), Conley et al.
patent: 2006/0086957 (2006-04-01), Kang
patent: 08-148665 (1996-06-01), None
patent: 09-222505 (1997-08-01), None
patent: 2001-68658 (2001-03-01), None
patent: 0165376 (1998-09-01), None
Stanley Wolf Ph.D.; Chapter 2, Isolation Technologies for Integrated Circuits; Silicon Processing for the VLSI Era, vol. 2: Process Integration; Copyright 1990; Lattice Press, Sunset Beach, CA.
People's Republic of China Office Action; Application No. 2005-10097115.8; Dated: Nov. 23, 2007; State Intellectual Property Office of People's Republic of China; People's Republic of China.
Otani Tomohiko; Device Having Microlens and Shape of Microlens; Patent Abstracts of Japan; Publication No. 09-222505; Publication Date: Aug. 26, 1997; Japan.
Nakano Takashi and Teranishi Shinichi; Solid Image Pickup Element; Patent Abstracts of Japan; Publication No. 08-148665; Publication Date: Jun. 7, 1996; Japan.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

CMOS image sensor and method for fabricating the same does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with CMOS image sensor and method for fabricating the same, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and CMOS image sensor and method for fabricating the same will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3978637

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.