Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate
2006-12-27
2009-12-15
Purvis, Sue (Department: 2826)
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Having insulated electrode
C257S440000, C257SE27135
Reexamination Certificate
active
07633104
ABSTRACT:
Embodiments relate to a vertical-type CMOS image sensor, a method of manufacturing the same, and a method of gettering the same, in which source and drain regions are expanded to improve grounding and gettering effects. In embodiments, the vertical-type CMOS image sensor may include a silicon substrate, a first photodiode formed in a prescribed part of the silicon substrate, a first epitaxial layer formed on the silicon substrate, a second photodiode formed on the first epitaxial layer to overlap the first photodiode, a second epitaxial layer formed on the first epitaxial layer, a third photodiode formed on the second epitaxial layer to overlap the second photodiode, and first to third grounded dummy moats formed by implanting impurities into uniform parts on the silicon substrate, the first epitaxial layer, and the second epitaxial layer.
REFERENCES:
patent: 5283460 (1994-02-01), Mita
patent: 6750489 (2004-06-01), Merrill
patent: 2002/0058353 (2002-05-01), Merrill
patent: 2005/0077571 (2005-04-01), Kanda et al.
patent: H13-168313 (2001-06-01), None
Dongbu Hi-Tek Co., Ltd.
Kuo W. Wendy
Purvis Sue
Sherr & Vaughn, PLLC
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