Clustered surface preparation for silicide and metal contacts

Details Clustered surface preparation for silicide and metal contacts Clustered surface preparation for silicide and metal contacts

2008-03-18

2008-03-18

Lebentritt, Michael (Department: 2812)

Semiconductor device manufacturing: process

Coating with electrically or thermally conductive material

To form ohmic contact to semiconductive material

C438S664000, C438S680000, C438S708000, C438S723000, C257SE21165

Reexamination Certificate

active

07344983

ABSTRACT:
A cluster tool is provided for the implementing of a clustered and integrated surface pre-cleaning of the surface of semiconductor devices. More particularly, there is provided a cluster tool and a method of utilization thereof in an integrated semiconductor device surface pre-cleaning, which is directed towards a manufacturing aspect in which a chamber for performing a dry processing chemical oxide removal (COR) on the semiconductor device surface is clustered with other tools, such as a metal deposition tool for silicide or contact formation, including the provision of a vacuum transfer module in the cluster tool.

REFERENCES:
patent: 5282925 (1994-02-01), Jeng et al.
patent: 6184132 (2001-02-01), Cantell et al.
patent: 6204120 (2001-03-01), Gilboa et al.
patent: 6207582 (2001-03-01), Shields et al.
patent: 6586340 (2003-07-01), Lee et al.
patent: 6776874 (2004-08-01), Kobayashi et al.
patent: 2001/0001298 (2001-05-01), Cantell et al.
patent: 2002/0144904 (2002-10-01), Yoo
patent: 2002/0162742 (2002-11-01), Bae et al.
patent: 2004/0092101 (2004-05-01), Pyo et al.

Affiliated with

Also associated with

Rating

Clustered surface preparation for silicide and metal contacts does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Clustered surface preparation for silicide and metal contacts, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Clustered surface preparation for silicide and metal contacts will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2793066