Cloverleaf microgyroscope with through-wafer interconnects...

Details Cloverleaf microgyroscope with through-wafer interconnects... Cloverleaf microgyroscope with through-wafer interconnects...

2006-03-21

2006-03-21

Mulpuri, Savitri (Department: 2812)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Physical stress responsive

C435S051000

Reexamination Certificate

active

07015060

ABSTRACT:
The present invention relates to a method of manufacturing a cloverleaf microgyroscope containing an integrated post comprising: attaching a post wafer to a resonator wafer, forming a bottom post from the post wafer being attached to the resonator wafer, preparing a base wafer with through-wafer interconnects, attaching the resonator wafer to the base wafer, wherein the bottom post fits into a post hole in the base wafer, forming a top post from the resonator wafer, wherein the bottom and top post are formed symmetrically around the same axis, and attaching a cap wafer on top of the base wafer.

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