4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. For high frequency device

Rachel Anderson

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Clip-type lead frame for source mounted die

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Reexamination Certificate

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Clip-type lead frame for source mounted die

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For high frequency device
Reexamination Certificate

  [ 0.00 ] – not rated yet Voters 0   Comments 0

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Profile ID: LFUS-PAI-P-2723735

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