Cleavable diepoxide for removable epoxy compositions

Drug – bio-affecting and body treating compositions – Preparations characterized by special physical form – Particulate form

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134 38, 134 42, 427386, 428620, 428626, 428413, 428414, 428416, 428417, 42840221, 428901, 528 93, 528 94, 528110, 528297, 528365, C08G 5900, C08G 6300

Patent

active

055609341

ABSTRACT:
A cleavable epoxy resin composition suitable for encapsulating electronic chips comprising the cured reaction product of a diepoxide containing a cyclic anhydride curing agent and an amine promoter.

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Lee and Neville, "Handbook of Epoxy Resins", McGraw-Hill, 1967, pp. 12-3 and 12-12.
Griffith (ACS Symposium Series) "Epxoy Resin Chemistry 1978", 114, pp. 5-7.
Sastri and Tesoro, "J. Appl. Polymer Sci.", 1990, 39 1425-1457.

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