Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent
1982-10-28
1986-01-28
Bernstein, Hiram H.
Adhesive bonding and miscellaneous chemical manufacture
Delaminating processes adapted for specified product
Delaminating in preparation for post processing recycling step
156DIG111, 156DIG89, 134 3, 134 42, C30B 1900
Patent
active
045669341
ABSTRACT:
In the liquid phase epitaxy growth of Group III-V compound semiconductors using boat-slider apparatus, melt-carry-over is essentially eliminated by prebaking the metallic solvent (e.g., In shot) in the boat to form ingots and then etching the ingots in dilute nitric or hydrochloric acid prior to adding solutes (e.g., GaAs, InP, dopants). This process removes contaminants which coalesce on the ingots and cause poor wipe-off.
REFERENCES:
patent: 3677228 (1972-07-01), Panish et al.
patent: 3890194 (1975-06-01), Ettenberg
Brasen Daniel
DiGiuseppe Michael A.
Lourenco Jose A.
Mahajan Subhash
AT&T Bell Laboratories
Bernstein Hiram H.
Urbano Michael J.
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