Cleaning solution for use on a semiconductor wafer following che

Details Cleaning solution for use on a semiconductor wafer following che Cleaning solution for use on a semiconductor wafer following che

1997-01-02

1998-08-04

McGinty, Douglas J.

Cleaning compositions for solid surfaces, auxiliary compositions

Cleaning compositions or processes of preparing

For cleaning a specific substrate or removing a specific...

134 3, 134 42, 134 41, 134 38, C11D 306, C11D 302, C23G 102, B08B 308

Patent

active

057893608

ABSTRACT:
A solution and method for cleaning a silicon wafer following a chemical-mechanical polishing process is disclosed. The cleaning solution being 0.1% to 99% by total solution volume of phosphoric acid, 0.1% to 25% by total solution volume of fluoroboric acid, and the balance of the solution, deionized water.

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