Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Reexamination Certificate
2006-08-01
2006-08-01
Webb, Gregory (Department: 1751)
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
C510S176000, C438S692000
Reexamination Certificate
active
07084097
ABSTRACT:
The present invention relates to a cleaning solution capable of removing efficiently at the same time particles and metallic impurities from a substrate surface without corroding metallic materials.The cleaning solution for cleaning substrates of electronic materials comprises an organic acid compound and at least one selected from the group consisting of dispersants and surfactants.
REFERENCES:
patent: 4222995 (1980-09-01), Roebke et al.
patent: 4292412 (1981-09-01), Wood
patent: 4518517 (1985-05-01), Eigen et al.
patent: 4790951 (1988-12-01), Frieser et al.
patent: 4913823 (1990-04-01), Lipinski et al.
patent: 4961859 (1990-10-01), Uehara et al.
patent: 5051327 (1991-09-01), Osawa et al.
patent: 5155015 (1992-10-01), Jimbo
patent: 6040283 (2000-03-01), Miner
patent: 6165690 (2000-12-01), Yoshida et al.
patent: 6291634 (2001-09-01), Tanaka et al.
patent: 6368777 (2002-04-01), Obuchowicz
patent: 6730644 (2004-05-01), Ishikawa et al.
patent: 2004/0167047 (2004-08-01), Ishikawa et al.
Abe Yumiko
Ishikawa Norio
Mori Kiyoto
Darby & Darby
Kanto Kagaku Kabushiki Kaisha
Webb Gregory
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