Cleaning solution and cleaning method of a semiconductor device

Details Cleaning solution and cleaning method of a semiconductor device Cleaning solution and cleaning method of a semiconductor device

2007-05-15

2007-05-15

Del Cotto, Gregory R. (Department: 1751)

Cleaning and liquid contact with solids

Processes

Including application of electrical radiant or wave energy...

C510S175000, C510S176000, C510S257000, C510S477000, C510S488000, C510S499000, C438S692000, C134S001300, C134S003000

Reexamination Certificate

active

11502011

ABSTRACT:
A cleaning method for removing foreign bodies during the fabrication of semiconductor devices including treating a substrate with a cleaning solution including an oxidizer to form a chemical oxide layer and then removing the chemical oxide layer, thereby removing foreign bodies from a surface of the semiconductor substrate. Accordingly, the foreign bodies can be substantially removed from the surface of the substrate without corroding a metal.

REFERENCES:
patent: 5972862 (1999-10-01), Torii et al.
patent: 6517738 (2003-02-01), Torek et al.
patent: 6562726 (2003-05-01), Torek et al.

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