Cleaning solution and cleaning method of a semiconductor device

Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...

Reexamination Certificate

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Details

C510S175000, C510S257000, C510S477000, C510S488000, C510S499000, C438S692000

Reexamination Certificate

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07105475

ABSTRACT:
A cleaning method for removing foreign bodies during the fabrication of semiconductor devices including treating a substrate with a cleaning solution including an oxidizer to form a chemical oxide layer and then removing the chemical oxide layer, thereby removing foreign bodies from a surface of the semiconductor substrate. Accordingly, the foreign bodies can be substantially removed from the surface of the substrate without corroding a metal.

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* Patent Abstracts of Japan for Publication No. 10-125642.

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