Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Reexamination Certificate
2006-09-12
2006-09-12
Del Cotto, Gregory R. (Department: 1751)
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
C510S175000, C510S257000, C510S477000, C510S488000, C510S499000, C438S692000
Reexamination Certificate
active
07105475
ABSTRACT:
A cleaning method for removing foreign bodies during the fabrication of semiconductor devices including treating a substrate with a cleaning solution including an oxidizer to form a chemical oxide layer and then removing the chemical oxide layer, thereby removing foreign bodies from a surface of the semiconductor substrate. Accordingly, the foreign bodies can be substantially removed from the surface of the substrate without corroding a metal.
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Choi Sang-Jun
Hong Chang-Ki
Kim Sang-Yong
Del Cotto Gregory R.
F. Chau & Associates LLC
Samsung Electronics Co,. Ltd.
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