Etching a substrate: processes – Mechanically shaping – deforming – or abrading of substrate
Reexamination Certificate
2005-02-17
2008-11-18
Culbert, Roberts (Department: 1792)
Etching a substrate: processes
Mechanically shaping, deforming, or abrading of substrate
C134S001000, C134S003000, C451S038000
Reexamination Certificate
active
07452475
ABSTRACT:
A method for treating a surface of a quartz substrate includes preparing a substrate to provide a working surface having an initial roughness; and then ultrasonically acid-etching the working surface to increase the roughness of the working surface by at least about 10%. In one embodiment, the initial surface roughness is greater than about 10 Ra, and in another embodiment the initial surface roughness is greater than about 200 Ra. In a still further embodiment, the initial surface area, if less than about 200 Ra, is increased to greater than about 200 Ra. In other embodiments of the present invention, the working surface roughness is increased by at least about 25% or at least about 50%. Simultaneous with the increase in surface area (as measured by the roughness), the surface defects are reduced to reduce particulate contamination from the substrate.
REFERENCES:
patent: 3775202 (1973-11-01), Meek et al.
patent: 3969195 (1976-07-01), Dötzer et al.
patent: 3986653 (1976-10-01), Gilding
patent: 3992454 (1976-11-01), Kessler
patent: 4023936 (1977-05-01), Morse et al.
patent: 4078963 (1978-03-01), Symersky
patent: 4101386 (1978-07-01), Dötzer et al.
patent: 4139348 (1979-02-01), Swartz
patent: 4197631 (1980-04-01), Meyer et al.
patent: 4214952 (1980-07-01), Sato et al.
patent: 4232060 (1980-11-01), Mallory, Jr.
patent: 4272612 (1981-06-01), Oliver
patent: 4327134 (1982-04-01), Baldi
patent: 4367119 (1983-01-01), Logan et al.
patent: 4447824 (1984-05-01), Logan et al.
patent: 4448800 (1984-05-01), Ehara et al.
patent: 4459155 (1984-07-01), Cayless
patent: 4519914 (1985-05-01), Etani
patent: 4530120 (1985-07-01), Etani
patent: 4579569 (1986-04-01), Sheng et al.
patent: 4638553 (1987-01-01), Nilarp
patent: 4699082 (1987-10-01), Hakim
patent: 4863561 (1989-09-01), Freeman et al.
patent: 4957583 (1990-09-01), Buck et al.
patent: 4971590 (1990-11-01), Tong
patent: 4980017 (1990-12-01), Kaji et al.
patent: 5104501 (1992-04-01), Okabayashi
patent: 5152878 (1992-10-01), Datta et al.
patent: 5221421 (1993-06-01), Leibovitz et al.
patent: 5365112 (1994-11-01), Ohshima
patent: 5489557 (1996-02-01), Jolley
patent: 5516399 (1996-05-01), Balconi-Lamica et al.
patent: 5565058 (1996-10-01), Banholzer et al.
patent: 5593339 (1997-01-01), Yam et al.
patent: 5614027 (1997-03-01), Dunn et al.
patent: 5665473 (1997-09-01), Okoshi et al.
patent: 5712198 (1998-01-01), Shive et al.
patent: 5744214 (1998-04-01), Berasi et al.
patent: 5766979 (1998-06-01), Budnaitis
patent: 5840402 (1998-11-01), Roberts et al.
patent: 5888308 (1999-03-01), Sachdev et al.
patent: 5891354 (1999-04-01), Lee et al.
patent: 5908819 (1999-06-01), Reynolds et al.
patent: 5910338 (1999-06-01), Donde
patent: 5929521 (1999-07-01), Wark et al.
patent: 5966593 (1999-10-01), Budnaitis et al.
patent: 6012966 (2000-01-01), Ban et al.
patent: 6187216 (2001-02-01), Dryer et al.
patent: 6368410 (2002-04-01), Gorczyca et al.
patent: 6506254 (2003-01-01), Bosch et al.
patent: 6569252 (2003-05-01), Sachdev et al.
patent: 6579153 (2003-06-01), Uchikura et al.
patent: 6767840 (2004-07-01), Uehara et al.
patent: 2003/0000458 (2003-01-01), Marumo et al.
patent: 2003/0091835 (2003-05-01), Takahashi et al.
patent: 2003/0096562 (2003-05-01), Kurogouchi
patent: 2004/0000327 (2004-01-01), Somboli et al.
patent: 2004/0060579 (2004-04-01), Kim et al.
patent: 2004/0238487 (2004-12-01), Kiehlbauch et al.
patent: 50089794 (1975-07-01), None
patent: 05259144 (1993-10-01), None
patent: 11-290805 (1999-10-01), None
Hoffman, H.S., Molybdenum Cleaning Solution,IBM Technical Disclosure Bulletin, 3(5):36, (1960).
Metrology for Manufacturing: Surface Measurement. [online] Michigan Technological University, undated [retrieved on Jun. 21, 2005]. Retrieved from the Internet: <URL: http://www.mfg.mtu.edu/cyberman/quality/metrology/surface.html>.
Spring, S.,Metal Cleaning, Reinhold Publishing Corporation, New York, pp. 85-89, (1963).
Chen Ning
Tan Samantha S. H.
Applied Materials Inc.
Culbert Roberts
Dugan & Dugan P.C.
LandOfFree
Cleaning process and apparatus for silicate materials does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cleaning process and apparatus for silicate materials, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cleaning process and apparatus for silicate materials will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4033154