Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...
Reexamination Certificate
2007-12-19
2011-10-25
Markoff, Alexander (Department: 1711)
Cleaning and liquid contact with solids
Processes
Including application of electrical radiant or wave energy...
C134S001000, C134S002000, C134S037000, C134S184000, C134S902000
Reexamination Certificate
active
08043435
ABSTRACT:
A cleaning liquid for an electronic material, in particular, a silicon wafer, uses ultra-pure water or hydrogen water as raw material water, and performs cleaning in combination with ultrasonic irradiation under the presence of hydrogen micro-bubbles. The method enables efficient cleaning and removal of particle components and the like on the wafer surface and prevention of re-contamination.
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Haibara Teruo
Mori Yoshihiro
Mouri Takashi
Brooks & Kushman P.C.
Markoff Alexander
Siltronic AG
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