Cleaning compositions for wafers used in semiconductor devices

Details Cleaning compositions for wafers used in semiconductor devices Cleaning compositions for wafers used in semiconductor devices

1998-07-01

1999-03-16

Alexander, Lyle A.

Cleaning compositions for solid surfaces, auxiliary compositions

Cleaning compositions or processes of preparing

For cleaning a specific substrate or removing a specific...

134 2, 134 3, 134 26, 134 28, 134 29, 134 36, 134 41, 134902, 510176, 510257, 510372, 510505, C11D 904

Patent

active

058830600

ABSTRACT:
An aqueous cleaning composition comprises from about 0.1 to about 2 percent of hydrogen fluoride based on the volume of the composition, from about 9 to about 15 percent of hydrogen peroxide based on the volume of the composition, and from about 41 to about 47 percent of C.sub.1 to C.sub.6 alcohol based on the volume of the composition. The aqueous cleaning composition may be advantageous in that it offers increased cleaning efficiency and less corrosion in comparison to conventional cleaning solutions.

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patent: 5670411 (1997-09-01), Yonchera et al.
patent: 5705089 (1998-01-01), Sugihara et al.
patent: 5782984 (1998-07-01), Lim et al.

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