Cleaning compositions for solid surfaces – auxiliary compositions – Cleaning compositions or processes of preparing – For cleaning a specific substrate or removing a specific...
Reexamination Certificate
2007-07-31
2007-07-31
Webb, Gregory (Department: 1751)
Cleaning compositions for solid surfaces, auxiliary compositions
Cleaning compositions or processes of preparing
For cleaning a specific substrate or removing a specific...
C510S176000
Reexamination Certificate
active
10617128
ABSTRACT:
The cleaning composition for removing resists includes a salt of hydrofluoric acid and a base not containing a metal (A component), a water-soluble organic solvent (B1 component), at least one organic acid or inorganic acid (C component), water (D component), and, optionally, an ammonium salt (E1 component), and having a pH4-8. Thus, in manufacturing a semiconductor device, such as a copper interconnecting process, efficiency of removing resist residue and other etching residue after etching or ashing is improved, and corrosion resistance of a copper and an insulating film is also improved.
REFERENCES:
patent: 5334332 (1994-08-01), Lee
patent: 5698503 (1997-12-01), Ward et al.
patent: 5750309 (1998-05-01), Hatakeyama et al.
patent: 5792274 (1998-08-01), Tanabe et al.
patent: 5972862 (1999-10-01), Torii et al.
patent: 6248704 (2001-06-01), Small et al.
patent: 6265309 (2001-07-01), Gotoh et al.
patent: 6323169 (2001-11-01), Abe et al.
patent: 6361712 (2002-03-01), Honda et al.
patent: 6462005 (2002-10-01), Gotoh et al.
patent: 6514352 (2003-02-01), Gotoh et al.
patent: 2002/0146647 (2002-10-01), Aoki et al.
patent: 2003/0004075 (2003-01-01), Suto et al.
patent: 2003/0114014 (2003-06-01), Yokoi et al.
patent: 2003/0138737 (2003-07-01), Wakiya et al.
patent: 1402090 (2003-03-01), None
patent: 1428659 (2003-07-01), None
patent: 7-201794 (1995-08-01), None
patent: 7-247498 (1995-09-01), None
patent: 8-202052 (1996-08-01), None
patent: 9-197681 (1997-07-01), None
patent: 10-55993 (1998-02-01), None
patent: 11-271985 (1999-10-01), None
patent: 2001-83712 (2001-03-01), None
patent: 2001-83713 (2001-03-01), None
patent: WO 02/19406 (2002-03-01), None
patent: WO 02/33033 (2002-04-01), None
Aoyama Tetsuo
Asaoka Yasuhiro
Hidaka Yoshiharu
Higashi Masahiko
Hiraga Toshitaka
EKC Technology K.K.
Leydig , Voit & Mayer, Ltd.
Matsushita Electric - Industrial Co., Ltd.
Renesas Technology Corp.
Webb Gregory
LandOfFree
Cleaning composition for removing resists and method of... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Cleaning composition for removing resists and method of..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Cleaning composition for removing resists and method of... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3818749