Cleaning a component of a process chamber

Details Cleaning a component of a process chamber Cleaning a component of a process chamber

2006-05-16

2006-05-16

Markoff, Alexander (Department: 1746)

Cleaning and liquid contact with solids

Processes

Using sequentially applied treating agents

C134S001100, C134S003000, C134S008000, C438S905000

Reexamination Certificate

active

07045020

ABSTRACT:
Process deposits formed on a component of a process chamber are cleaned. In the cleaning method, gas holes in the component are mechanically pinned to clean the process deposits therein. A ceramic portion of the component is then exposed to an acidic solution, such as a solution of hydrofluoric acid and nitric acid. Mechanical pinning of the gas holes may be repeated after the acid cleaning step. The component is then plasma stabilized in a plasma zone by introducing a non-reactive gas into the plasma zone and forming a plasma of the non-reactive gas in the plasma zone. In one version, the component comprises an electrostatic chuck comprising a ceramic covering an electrode and having the gas holes therein.

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