Clamping ring apparatus for processing semiconductor wafers

Details Clamping ring apparatus for processing semiconductor wafers Clamping ring apparatus for processing semiconductor wafers

1992-09-18

1994-05-31

Watson, Robert C.

Work holders

Relatively movable jaws

Means to actuate jaw

269288, 269903, B25B 100

Patent

active

053162781

ABSTRACT:
An improved clamping ring apparatus is disclosed comprising a clamping ring means for yieldably engaging a generally circular semiconductor wafer to peripherally clamp the wafer to a support pedestal to provide a peripheral seal between the wafer and the surface of the pedestal facing the wafer, adjacent the generally circular end edge of the wafer by providing a central generally circular opening in the clamping ring and a series of slots which radially extend outwardly from the central opening in the clamping ring means to thereby divide the inner portion of the clamping ring means into a series of yieldable fingers inwardly extending toward the central opening in the clamping ring means.
In one embodiment, the sidewalls of the slots are slanted with respect to the planar surface of the clamping ring means at an angle sufficient, with respect to the thickness of the clamping ring means and the width of the slot,, to prevent a ray or a particle from a plasma, traveling in a direction perpendicular to the plane of the surface of the clamping ring means from striking surfaces underlying the clamping ring means, through the slot.

REFERENCES:
patent: 1482566 (1924-02-01), Keller
patent: 3927955 (1976-08-01), Nevis et al.
patent: 4473455 (1984-09-01), Dean et al.
patent: 4767984 (1988-08-01), Bakker
patent: 4807421 (1989-02-01), Araki et al.
patent: 5037262 (1991-08-01), Moll et al.
patent: 5203981 (1993-04-01), Akazawa

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