Clamping and de-clamping semiconductor wafers on an...

Electricity: electrical systems and devices – Electric charge generating or conducting means – Use of forces of electric charge or field

Reexamination Certificate

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

C361S235000

Reexamination Certificate

active

06947274

ABSTRACT:
The present invention is directed to a method for clamping a wafer to an electrostatic chuck using a single-phase square wave AC clamping voltage. The method comprises determining a single-phase square wave clamping voltage for the electrostatic chuck, wherein the determination is based, at least in part, on an inertial response time of the wafer. The wafer is placed on the electrostatic chuck, wherein a gap between the electrostatic chuck and the wafer is defined. The determined single-phase square wave clamping voltage is then applied, wherein the wafer is generally clamped to the electrostatic chuck within a predetermined distance, while an amount of electrostatic charge is generally not allowed to accumulate, thereby enabling a fast de-clamping of the wafer.

REFERENCES:
patent: 5103367 (1992-04-01), Horwitz et al.
patent: 5117121 (1992-05-01), Watanabe et al.
patent: 5325261 (1994-06-01), Horwitz
patent: 5444597 (1995-08-01), Blake et al.
patent: 5452177 (1995-09-01), Frutiger
patent: 5583736 (1996-12-01), Anderson et al.
patent: 5754391 (1998-05-01), Bates
patent: 5793192 (1998-08-01), Kubly et al.
patent: 5810933 (1998-09-01), Mountsier et al.
patent: 5838529 (1998-11-01), Shufflebotham et al.
patent: 5916689 (1999-06-01), Collins et al.
patent: 5946184 (1999-08-01), Kanno et al.
patent: 5958813 (1999-09-01), Aida et al.
patent: 6117246 (2000-09-01), Parkhe et al.
patent: 6149774 (2000-11-01), Sun et al.
patent: 6187149 (2001-02-01), Sun et al.
patent: 6215643 (2001-04-01), Nagasaki
patent: 6236555 (2001-05-01), Leeser
patent: 6373681 (2002-04-01), Kanno et al.
patent: 6378600 (2002-04-01), Moslehi
patent: 6388861 (2002-05-01), Frutiger
patent: 6475351 (2002-11-01), Sun et al.
patent: 10284583 (1998-10-01), None

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Clamping and de-clamping semiconductor wafers on an... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Clamping and de-clamping semiconductor wafers on an..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Clamping and de-clamping semiconductor wafers on an... will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-3401573

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.