Clamp ring for domed heated pedestal in wafer processing chamber

Details Clamp ring for domed heated pedestal in wafer processing chamber Clamp ring for domed heated pedestal in wafer processing chamber

1994-08-24

1998-03-10

Griffin, Walter D.

Adhesive bonding and miscellaneous chemical manufacture

Differential fluid etching apparatus

With microwave gas energizing means

118728, 20429815, C23F 102

Patent

active

057257183

ABSTRACT:
A chamber for processing a semiconductor wafer, in which the chamber houses a domed pedestal for supporting the wafer inside the chamber and a clamp ring having a seat formed therein. The seat receives and holds down the periphery of the wafer onto the domed pedestal and includes a wafer engaging surface which engages and holds down the periphery of the wafer. In use the wafer engaging surface defines an angle to the horizontal which is greater than or equal to the angle to the horizontal defined by a tangent to the domed pedestal at the point where the periphery of the wafer is held down onto the pedestal. Typically the angle to the horizontal defined by the seat is about 3.degree. greater than the angle of the tangent to the domed pedestal at the point where the wafer is held down onto the pedestal.

REFERENCES:
patent: 4978412 (1990-12-01), Aoki et al.
patent: 5108569 (1992-04-01), Gilboa et al.
patent: 5203958 (1993-04-01), Arai et al.
patent: 5437757 (1995-08-01), Rice et al.

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