Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
Patent
1995-03-06
1996-02-13
Nguyen, Nam
Chemistry: electrical and wave energy
Processes and products
Coating, forming or etching by sputtering
20419222, 20429806, 20429808, 20429825, 20429826, C23C 1434
Patent
active
054909104
ABSTRACT:
A sputtering apparatus for depositing thin films on substrates is disclosed, which includes a process chamber having a central sputtering region and an annular plasma distribution region surrounding and open to the central sputtering region, a planar disk diode positioned in the central sputtering region of the process chamber, a mechanism for positioning a substrate within the central sputtering region adjacent to the planar disk diode, and a plasma generation means for supplying plasma to the annular plasma distribution region of the process chamber for diffusion into the central sputtering region.
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Nelson Carl W.
Weir Richard D.
Nguyen Nam
Tulip Memory Systems, Inc.
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