Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate
2005-12-13
2005-12-13
Garbowski, Leigh M. (Department: 2825)
Computer-aided design and analysis of circuits and semiconductor
Nanotechnology related integrated circuit design
C716S030000, C257S774000
Reexamination Certificate
active
06976238
ABSTRACT:
Some embodiments of the invention provide vias that are not in shape of quadrilaterals. In some embodiments, some or all vias are in shape of non-quadrilateral polygons, such as octagons and hexagons. In some embodiments, some or all vias have a circular shape. Some embodiments provide a first set of vias that have a diamond shape and a second set of vias that have a rectangular shape. In some embodiments, a via can also be formed by a diamond contact and a rectangular contact. The diamond contact has four sides. In the embodiments described below, all four sides of a diamond via contact have equal sides. However, in other embodiments, a via contact can be in shape of a diamond with a pair of sides that are longer than the other pair of sides. Similarly, in the embodiments described below, the rectangular via contacts are squares with four equal sides. However, in other embodiments, the length and width of a rectangular via contact can differ. Some embodiments of the invention provide interconnect lines that have non-rectangular ends. In some embodiments, the interconnect-line ends are partial octagons, hexagons, and/or circles. Also, some embodiments provide Steiner points that are not rectangular. In some embodiments, the Steiner points are octagonal, hexagonal, or circles.
REFERENCES:
patent: 4342045 (1982-07-01), Kim
patent: 4615011 (1986-09-01), Linsker
patent: 4673966 (1987-06-01), Shimoyama
patent: 4700016 (1987-10-01), Hitchcock et al.
patent: 4724471 (1988-02-01), Leuschner
patent: 4782193 (1988-11-01), Linsker
patent: 4812419 (1989-03-01), Lee et al.
patent: 5055966 (1991-10-01), Smith et al.
patent: 5063175 (1991-11-01), Broadbent
patent: 5360948 (1994-11-01), Thornberg
patent: 5578840 (1996-11-01), Scepanovic et al.
patent: 5618744 (1997-04-01), Suzuki et al.
patent: 5620916 (1997-04-01), Eden et al.
patent: 5633479 (1997-05-01), Hirano
patent: 5650653 (1997-07-01), Rostoker et al.
patent: 5657242 (1997-08-01), Sekiyama et al.
patent: 5726499 (1998-03-01), Irinoda
patent: 5742086 (1998-04-01), Rostoker et al.
patent: 5757656 (1998-05-01), Herhsberger et al.
patent: 5777360 (1998-07-01), Rostoker et al.
patent: 5784262 (1998-07-01), Sherman
patent: 5811863 (1998-09-01), Rostoker et al.
patent: 5822214 (1998-10-01), Rostoker et al.
patent: 5889329 (1999-03-01), Rostoker et al.
patent: 5914887 (1999-06-01), Scepanovic et al.
patent: 5973376 (1999-10-01), Rostoker et al.
patent: 6035108 (2000-03-01), Kikuchi
patent: 6067409 (2000-05-01), Scepanovic et al.
patent: 6128767 (2000-10-01), Chapman
patent: 6137182 (2000-10-01), Hause et al.
patent: 6166441 (2000-12-01), Geryk
patent: 6209123 (2001-03-01), Maziasz et al.
patent: 6226560 (2001-05-01), Hama et al.
patent: 6229214 (2001-05-01), Jang
patent: 6247853 (2001-06-01), Papadopoulou et al.
patent: 6262487 (2001-07-01), Igarashi et al.
patent: 6292929 (2001-09-01), Scepanovic et al.
patent: 6300683 (2001-10-01), Nagasaka et al.
patent: 6301686 (2001-10-01), Kikuchi et al.
patent: 6310398 (2001-10-01), Katz
patent: 6320391 (2001-11-01), Bui
patent: 6324675 (2001-11-01), Dutta et al.
patent: 6342682 (2002-01-01), Mori et al.
patent: 6365958 (2002-04-01), Ibnabdeljalil et al.
patent: 6385758 (2002-05-01), Kikuchi et al.
patent: 6407434 (2002-06-01), Rostoker et al.
patent: 6412097 (2002-06-01), Kikuchi et al.
patent: 6436804 (2002-08-01), Igarashi et al.
patent: 6441494 (2002-08-01), Huang et al.
patent: 6483481 (2002-11-01), Sievenpiper et al.
patent: 6512292 (2003-01-01), Armbrust et al.
patent: 6522014 (2003-02-01), Egitto et al.
patent: 6546540 (2003-04-01), Igarashi et al.
patent: 6566755 (2003-05-01), Gardner
patent: 6586281 (2003-07-01), Gabara et al.
patent: 6596466 (2003-07-01), Pohland et al.
patent: 6615400 (2003-09-01), Lukanc
patent: 6645842 (2003-11-01), Igarashi et al.
patent: 6680150 (2004-01-01), Blatchford, Jr. et al.
patent: 6787905 (2004-09-01), Goerlach et al.
patent: 2001/0002713 (2001-06-01), Goda et al.
patent: 2001/0003843 (2001-06-01), Scepanovic et al.
patent: 2002/0024115 (2002-02-01), Ibnadeljalil et al.
patent: 2002/0174413 (2002-11-01), Tanaka
patent: 2002/0182844 (2002-12-01), Igarashi et al.
patent: 2003/0005399 (2003-01-01), Igarashi et al.
patent: 2003/0025205 (2003-02-01), Shively
patent: 2003/0121017 (2003-06-01), Andreev et al.
patent: 03-173471 (1991-07-01), None
patent: 04-000677 (1992-01-01), None
patent: 05-102305 (1993-04-01), None
patent: 05-243379 (1993-09-01), None
patent: 07-086407 (1995-03-01), None
patent: 09-162279 (1997-06-01), None
patent: 2000-082743 (2000-03-01), None
U.S. Appl. No. 10/066,060, filed Jan. 31, 2002, Steven Teig, Application with the same specification and drawings as the present application, with the exception of summary and abstract.
U.S. Appl. No. 10/066,160, filed Jan. 31, 2002, Steven Teig et al., Application with the same specification and drawings as the present application, with the exception of summary and abstract.
U.S. Appl. No. 10/066,095, filed Jan. 31, 2002, Steven Teig et al., Application with the same specification and drawings as the present application, with the exception of summary and abstract.
U.S. Appl. No. 10/066,047, filed Jan. 31, 2002, Steven Teig et al., Application with the same specification and drawings as the present application, with the exception of summary and abstract.
U.S. Appl. No. 10/061,641, filed Jan. 31, 2002, Steven Teig et al., Application with the same specification and drawings as the present application, with the exception of summary and abstract.
U.S. Appl. No. 10/076,121, filed Feb. 12, 2002, Steven Teig, CIP of the present application.
U.S. Appl. No. 10/062,995, filed Jan. 31, 2002, Steven Teig et al., Application with the same specification and drawings as the present application, with the exception of summary and abstract.
U.S. Appl. No. 10/066,102, filed Jan. 31, 2002, Steven Teig, Application with the same specification and drawings as the present application, with the exception of summary and abstract.
U.S. Appl. No. 10/066,187, filed Jan. 31, 2002, Steven Teig et al., Application with the same specification and drawings as the present application, with the exception of summary and abstract.
U.S. Appl. No. 10/233,202, filed Aug. 28, 2002, Steven Teig, Per the preliminary amendment dated May 30, 2003, this application is a CIP of the present application.
U.S. Appl. No. 10/229,196, filed Aug. 26, 2002, Steven Teig, Per the preliminary amendment dated May 30, 2003, this application is a CIP of the present application.
U.S. Appl. No. 10/288,870, filed Nov. 6, 2002, Steven Teig, Per the preliminary amendment dated May 30, 2003, this application is a CIP of the present application.
U.S. Appl. No. 10/219,923, filed Aug. 14, 2002, Steven Teig, Per the preliminary amendment dated May 30, 2003, this application is a CIP of the present application.
Berger, B. et al., Nearly Optimal Algorithms and Bounds for Multilayer Channel Routing, Journal of the Association for Computing Machinery, pp. 500-542, Mar. 1995.
Chen, H., Routing L-Shaped Channels in Nonslicing-Structure Placement. 24thACM-IEEE Design Automation Conference, pp. 152-165, 1987.
Cheng, K. et al., Manhattan or Non Manhattan? A Study of Alternative VLSI Routing Architectures, pp 47-52, 2000.
Chiang, C. et al., Wirability of Knock-Knee Layouts with 45° Wires, IEEE Transactions on Circuits and Systems, vol. 38, Issue 6, pp 613-624, Jun. 1991.
NN71091316, Use of Relatively Diagonal And Rectangular Wiring Planes n Multilayer Packages, Sep. 1971, IBM Technical Disclosure Bulletin, vol. No. 14, Issue No. 4, pp. 1316-1317.
Overtone, G., EDA Underwriter 2 Finding Space in a Multi-Layer Board, Electronic Engineering, Morgan-Grampian LTD, Mar. 1995, vol. 67, No. 819, pp 29-30.
Caldwell Andrew
Fujimura Akira
Teig Steven
Cadence Design Systems Inc.
Garbowski Leigh M.
Stattler, Hohansen, & Adeli LLP
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