Circuit structures including integrated circuits

Details Circuit structures including integrated circuits Circuit structures including integrated circuits

1979-01-23

1981-09-08

Godici, Nicholas P.

Adhesive bonding and miscellaneous chemical manufacture

Delaminating processes adapted for specified product

Delaminating in preparation for post processing recycling step

29834, 29832, 156647, 156657, 156662, H01L 2348, H05K 330

Patent

active

042888085

ABSTRACT:
The specification discloses a structure for locating integrated circuits on a substrate by etching V grooves in a silicon substrate arranged to co-operate with spheroidal connectors on the integrated circuit. Contact pads are located in the V grooves whereby connections are made to the integrated circuit through the spheroidal connectors.

REFERENCES:
patent: 3585714 (1971-06-01), Chou
patent: 3716907 (1973-02-01), Anderson
patent: 3725160 (1973-04-01), Bean et al.
patent: 4070748 (1978-01-01), Legat et al.

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