Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate
2005-08-09
2005-08-09
Chaudhari, Chandra (Department: 2891)
Active solid-state devices (e.g., transistors, solid-state diode
Field effect device
Having insulated electrode
C257S360000, C257S365000, C257S382000, C257S383000, C257S395000
Reexamination Certificate
active
06927457
ABSTRACT:
A circuit structure for connecting a bonding pad with an electrostatic discharge protection circuit. The circuit structure includes a plurality of conductive layers, a first plurality of first vias, a first conductive line, a plurality of second conductive lines and a plurality of second vias. The conductive layers are parallel layers each at a different height level between the bonding pad and a substrate. The first vias connect the bonding pad electrically with a neighboring conductive layer as well as each neighboring conductive layer. The first conductive line connects electrically with the conductive layer nearest the substrate and the drain terminal of an ESD protection circuit. The second conductive lines are parallel lines each at a different height level between the first conductive line and the bonding pad. Each second conductive line connects electrically with the conductive layer at a corresponding height level. The second vias connect electrically with the first conductive line and the second conductive line adjacent to the first conductive line as well as each neighboring second conductive line.
REFERENCES:
patent: 6037636 (2000-03-01), Crippen
patent: 6153913 (2000-11-01), Hsu et al.
patent: 6376881 (2002-04-01), Nagaya
patent: 6462384 (2002-10-01), Kwon
Chou Jin-Tau
Huang Shao-Chang
Chaudhari Chandra
J.C. Patents
Menz Douglas
United Microelectronics Corp.
LandOfFree
Circuit structure for connecting bonding pad and ESD... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Circuit structure for connecting bonding pad and ESD..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Circuit structure for connecting bonding pad and ESD... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3508961