Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent
1991-12-16
1994-03-15
Mintel, William
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
257721, 361690, 174 163, 165 803, H01L 2302, H01L 2504
Patent
active
052948315
ABSTRACT:
Dissipation of the heat produced by the operation of electronic circuitry may be improved by a heat sink which comprises a flat base from which a number of vertical fins extend. The fins are parallel to one another and define a number of parallel channels into which coolant flow is directed. The thermal resistance of the heat sink is optimized by setting fin thickness and channel width parameters to appropriate values. The heat sink may be attached in a heat conductive manner to a heat producing electronic component. One or more of these heat sinked components may be laid out in an in-line or staggered arrangement on a support in the form of a circuit pack. Cooling fluid is delivered to the circuit pack in a variety of ways to cool the heat sinked components. A method of determining the optimum fin thickness and channel width parameters involves determining a relationship between total thermal resistance of the heat sink and combinations of fin thickness and channel width parameters. A contour plot is produced in accordance with the relationship referred to above. The contour plot shows regions of optimum heat dissipation for heat sinks in accordance with the geometry identified here.
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Azar Kaveh
Caron Richard E.
AT&T Bell Laboratories
Indyk Eugene S.
Mintel William
Ostrowski David
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